2023/12/19
Event
Thank you for visiting our booth at the APCS/SEMICON Japan 2023 !
Thank you for visiting our company booth during the APCS/SEMICON Japan 2023.
If you would like further explanation about our products and services, feel free to contact us at the following address: fict-exhibition@fict-g.com
Our Booth Pannel
| Glass Core Package Substrate NEW | Large FC-BGA Substrate for Large Die and Chiplet Integration |
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| Ultra-High-Speed and Ultra-High-Layer PWBs | Advanced LSI Test Board |
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