FICT - The Future is interconnected FICT - The Future is interconnected

Product

Highly reliable and high-performance large semiconductor packaging substrates, Multilayer PCBs for ICT infrastructure devices such as supercomputers and high density HDI PCBs for edge devices such as in-vehicle equipment.

Multilayer PCBs(High Density Interconnect PCBs/
High Speed Transmission PCBs/Thick Copper PCBs)

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We provide highly reliable multilayer PCB,
high speed transmission PCB and high current / high dissipation PCB

High Density Interconnect PCBs

We provide High-performance and High-reliability multilayer PCBs for ICT infrastructure systems and Social systems. Our High-density PCBs are applicable to place 0.8mm pitch 4000pin class BGA LSIs on both sides of the PCBs.

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High Speed Transmission PCBs

We provide high-performance multilayer PCBs, enabling ultra-high-speed transmission, with the latest technology to minimize transmission loss at high frequency by the PCB structure, decreasing open Via-stub. The high-speed transmission over 40Gbps is achieved by overall technology of the pattern surface smoothing, the back-drilling fabrication and the low loss dielectric material optimization.

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Thick Copper PCBs

We provide thick copper and good thermal conductive PCBs for large electric current applications of industrial systems and power electronics products. We propose best PCB solutions, applying copper coin technology and good thermal conductive materials for cooling high power devices.

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HDI PCBs

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Our state-of-the-art HDI PCB with any-layer-IVH buildup technology ensures
high reliability and high density of wiring capacity.
This technology is suitable for automotive devices
which require high reliability or devices for thinner and lighter products.

HDI PCBs

We provide total solution including PCB design, PCB manufacturing and assembly for automotive, tablet PCs, IoT modules and other Omnipresent products.

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Probe Cards

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Probe Cards

Our state-of-the-art technology provides innovative organic PCBs, best suited for probe cad applications with huge wiring capacity over 10000 nets, achieving high-quality signal integrity.

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Packaging Substrate

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Semiconductor packaging substrates for high-performance large die multichip LSIs,
that enable high energy efficiency at high-speed data transmission
and high frequency stable operation with embedded thin film capacitors.

Substrate structure with embedded TFC (Thin Film Capacitor), GigaModule-EC

GigaModule-EC, a best suitable packaging substrate with embedded thin film capacitor (TFC) for next high-performance & energy-saving semiconductors

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FC-BGA Substrates GigaModule-2

A state-of-the-art large FC-BGA packaging substrate with >100 sq. mm size buildup is available for large Die and multi-chip packaging with small quantity and short-term manufacturing

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