Product ｜ FICT LIMITED

We design and manufacture highly reliable, high-performance printed circuit boards (PCBs) and substrates for semiconductor-related equipment, ICT infrastructure--including supercomputers--as well as semiconductor testing equipment, such as wafer probe cards.

Multilayer PCBs(High Density Interconnect PCBs/High Speed Transmission PCBs/Thick Copper PCBs)

We provide highly reliable multilayer PCBs, high-speed transmission PCBs, and high-current/high-dissipation PCBs.

High Density Interconnect PCBs

We provide highly reliable multilayer printed circuit boards specifically designed for advanced ICT infrastructure equipment and other high-performance products, including social infrastructure equipments. Our high-density multilayer wiring boards are compatible with a 0.8 mm pitch and support 4000-pin class BGA configurations.

High Speed Transmission PCBs

We offer high-performance multilayer PCBs designed for ultra-high-speed transmission. By leveraging the latest technology, we minimize transmission loss at high frequencies through optimized PCB structures and reduced open via stubs. Our advanced techniques, which include surface pattern smoothing, back-drilling fabrication, and the optimization of low-loss dielectric materials, enable transmission rates exceeding 40 Gbps.

Thick Copper PCBs

We provide thick copper and highly thermally conductive PCBs designed for high-current applications in industrial systems and power electronics. Our PCB solutions employ copper coin technology and advanced thermally conductive materials to efficiently dissipate heat from high-power devices.

HDI PCBs

We provide comprehensive solutions that include PCB design, mounting simulation, and manufacturing for high-performance, high-speed transmission equipment, including the latest communication devices.

Probe Cards

Our state-of-the-art technology delivers innovative organic printed circuit boards (PCBs) specifically designed for probe card applications. These PCBs feature an impressive wiring capacity of over 10,000 nets while ensuring high-quality signal integrity.

Packaging Substrate

Semiconductor packaging substrates for high-performance large die multichip LSIs, that enable high energy efficiency at high-speed data transmission and high frequency stable operation with embedded thin film capacitors.

FC-BGA Substrates GigaModule-2

A state-of-the-art large FC-BGA packaging substrate with a buildup size exceeding 100 mm² is available for large die and multi-chip packaging, making it suitable for low-volume and short-term manufacturing.

Substrate structure with embedded TFC (Thin Film Capacitor), GigaModule-EC

GigaModule-EC is an advanced packaging substrate that integrates thin film capacitors (TFCs) to support next-generation, high-performance, and energy-efficient semiconductors.

The Essence of FICT

We developed the base of the Semiconductor Packaging Substrate

Meet our members bringing insightful information and little-known anecdotes about the Semiconductor Packaging Substrate World.