FICT - The Future is interconnected FICT - The Future is interconnected

Company

History

History

You can read about the key milestones in the company's history here.

1967
Dec
1967
Begins production of Multilayer PCB at kawasaki Plant as a PCB business unit of Fujitsu
1972
March
1972
Moves PCB production to Nagano Plant
Sep
Begins production of High-density Multilayer PCB (18-layer)
1973
1973
Begins production of PCB at Kanuma Plant
1983
July
1983
Opens Akashi Plant for mass production
1985
Feb
1985
Begins production of Large-size High-density Multilayer PCB (42-layer)
1988
Jan
1988
Begins production of High-multilayer ceramic PCB (62-layer)
1993
Dec
1993
Begins production of Multi-chip-module (Thin-film 5-layer)
1994
March
1994
Obtains ISO 9001 Certification
1995
Sep
1995
Begins production of PCB mounting at Fujitsu Computer Products of Vietnam, Inc.
1996
July
1996
Begins production of PCB at Fujitsu Computer Products of Vietnam, Inc.
1997
March
1997
Obtains ISO 14001 Certification
1999
April
1999
Begins production of FC-BGA Substrate (GigaModule)
2001
April
2001
Begins mass production of Organic Multi-chip-module
2002
Oct
2002
  • FUJITSU INTERCONNECT TECHNOLOGIES LIMITED becomes independent company from FUJITSU LIMITED
  • Begins PCB business
  • Production) Consolidated production at Nagano Plant and Vietnam Plant
  • Sales) Based in Kawasaki, Kansai, U.S.A., and Taiwan
2003
Jan
2003
Announces joint development of Printed Wiring Board with a new structure in partnership with Matsushita Electric Components Co., Limited
Sep
Begins production of next-generation probe cards
2004
March
2004
Develops world's first Multi-layer PCB capable of 5Gbps transmission and 4000 pin mounting
2005
April
2005
Begins production of coreless FC-BGA Substrates (GigaModule)
2006
2006
  • Improves production capacity of FC-BGA Substrates (GigaModule)
  • Expands types of next-generation probe cards by commercializing first-generation BBC technology
2007
2007
Improves production capacity of high layer count, high aspect substrates
2011
2011
Begins production of the "K computer" substrate
2012
2012
Receives Japan Institute of Electronics Packaging's 2012 Technology Award, jointly with Fujitsu Advanced Technology Limited, for the development of the substrate for the K computer.
2013
Jan
2013
  • Absorbes SHIN-ETSU FUJITSU LIMITED
  • Succeeds to the Boring Business for boards and the Technical Service Business.
2015
2015
Develops the innovative Any Layer IVH "F-ALCS technology", enabling huge wiring capacity
2016
2016
Begins production of TFC Embedded GigaModule-EC Series for Ultra-high speed application
2016
Sep
2016
Obtains OHSAS18001:2007 Certification
2019
2019
Begins production of Printed Wiring Board for Supercomputer Fugaku
2019
Sep
2019
Obtains ISO 45001 Certification
2020
Oct
2020
  • Acquired Fujitsu Computer Products of Vietnam, Inc. as its wholly owned subsidiary
  • Welcomed funds served by Advantage Partners as the company major shareholder
2022
Jan
2022
Changed its trade name to FICT LIMITED from FUJITSU INTERCONNECT TECHNOLOGIES LIMITED along with its wholly owned subsidiary to FICT VIETNAM COMPANY LIMITED from Fujitsu Computer Products of Vietnam, Inc.