We support our customer in its product development by offering
solution services such as
electrical &
physical simulation, board
design, assembly and reliability testing.
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Event2024/04/03
Our participation to the International Conference on Electronics Packaging (ICEP2024)
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Information2024/03/18
Offices Closed for the National Holidays
(April 27 - May 6, 2024) -
Information2023/12/25
FICT featured in TIME Magazine ｜PERSON OF THE YEAR
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Event2023/12/19
Thank you for visiting our booth at the APCS/SEMICON Japan 2023 !
Our Brand
Read MoreThis is a trailer of FICT brand movie.
You can watch the complete version in the brand page of our corporate website.
Don't miss it!
We developed the base of the Semiconductor Packaging Substrate
Meet our members bringing insightful information and little-known anecdotes about the Semiconductor Packaging Substrate World
We respond to the needs of the most advanced
technologies in order to create new value
that opens up
the future together with our customers.
We develop highly reliable and high-performance
Semiconductor Packaging Substrates and
Multilayer PCBs for a wide range of
application.
Technical services such as data recovery, quality and reliability
testing, and fault
analysis for storage device products such as
HDDs, SSD and flash memory.
Our activities to build a sustainable society
Read More