High-end PCBs and substrates manufacturer.
For more than half a century, FICT has been at the forefront of technological advancements in high-end PCBs and substrates, serving applications that range from supercomputers to semiconductor test equipment. FICT's technologies and products are instrumental in shaping the Future of the advanced information network society by offering innovative solutions to global challenges.
We provide high-quality printed circuit boards and semiconductor package substrates used across a diverse array of fields,including supercomputers and high-end servers that support artificial intelligence and big data processing,as well as base stations and transmission equipment that establish high-speed,high-capacity 5G communication networks.By leveraging cutting-edge technology,we deliver solutions that meet a wide range of global demands.
We meet the demands of cutting-edge technologies to create new value that paves the way for a collaborative future with our clients.
Read More
We develop highly reliable, high-performance semiconductor packaging substrates and multilayer printed circuit boards (PCBs) for a wide variety of applications.
Read More
We assist our customers with product development by providing a comprehensive range of solution services, including electrical and physical simulations, circuit board design, and reliability testing.
Read More
We offer a comprehensive range of technical services, including data recovery, data erasure, failure analysis & reliability testing, and media conversion service for storage device products such as HDDs, SSDs, and flash memory.
Read More
Unveiling the Future of PCB Technology
Discover the groundbreaking innovations of FICT with our advanced PCB technologies: F-ALCS and G-ALCS. From F-ALCS, which delivers unmatched speed and density, to G-ALCS, pioneering the use of glass substrates for next-generation applications, this video showcases the cutting-edge advancements shaping the future.
