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Product

HDI PCBs

About Product

We provide total solution including PCB design, PCB manufacturing and assembly for automotive, tablet PCs, IoT modules and other Omnipresent products.

Mission & Solution Best Solutions for
Customer Problems

We provide total solutions for not only PCBs/PCBAs but also for its system cabinet to meet the miniaturization and thinner needs of our customer’s product.

01
How to reduce product size to 50%

We offer optimal PCB solutions with rigid, thin and lightweight materials to realize the miniaturization of the product. We propose stress-strain analysis to solve warpage problems that associated with the product miniaturization and also the junction reliability problems for device mounting.

Thermal problems associated with the miniaturization

More details for “Stress Analysis”

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02
Thermal problems associated with the miniaturization

We provide total solutions with our thermal and fluid analysis for the cooling problems of heat spot occurred by the miniaturization.

How to reduce product size to 50%

More details for “Thermal Management Analysis”

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03
Total PCB Solutions from manufacturing to assembly in ASEAN

Our Vietnam facility provides PCB manufacturing and parts assembly on the same site. We provide timely delivery services with the electronic customs clearance system.
In addition to ISO -9001 certification, we have also acquired IATF -16949 certification.
Note: IATF: International certification about automobile Our alliance with a molding company located near our facility allows us to extend our services to the parts assembly to plastic molding cases.

We can solve the problem!

Case Study Application Fields

Our PCB production fields include a wide range of products and devices, such as high reliability automotive products, high density mobile devices and IoT modules. We introduce our product application below.

01
Sequential lamination and buildup PCB for Automotive

Application Layer Count Outline of Specifications
Car Navigation 6 to 10 Layers Thickness:1.2mm,
L/S:70µm/90µm
ECU for Automotive 4 to 8 Layers Sequential Lamination Thickness:1.6mm,
L/S:100μm/100μm
Drive Recorder 8 Layers
(2-4-2)
Thickness: 1.2mm,
L/S:70µm/90µm
Sequential lamination and buildup PCB for Automotive

02
High density buildup PCB for Smartphone and IoT modules

Application Layer Count Outline of Specifications
Tablet PC 10 Layers
(4-2-4)
Thickness: 0.67mm,
L/S:50µm/50µm
Smartphone 10 to 12 Layers
(5-2-5)
Thickness: 0.67mm,
L/S:50µm/50µm
High density buildup PCB for Smartphone and IoT modules

03
High density buildup PCB for note PC

Application Layer Count Outline of Specifications
Note PC 10 Layers
(2-6-2)
Thickness:1.00mm,
L/S:60µm/80µm
Mobile Note PC 10 Layers
(3-4-3)
Thickness:0.95mm,
L/S:60µm/70µm
High density buildup PCB for note PC

04
High Density Interconnect PCB

Application Layer Count Outline of Specifications
Camera Module 8 Layers
(2-4-2)
Thickness:0.85mm,
L/S:75µm/75µm
Mobile Note PC 10 Layers Thickness:1.60mm,
L/S:75µm/75µm
High Density Interconnect PCBs

Specification Outline of PCB Specifications

MV Series Buildup PCBs

Multi-Via technology enables ultra-high density PCB.

  • Buildup PTH, up to 5-x-5 (x: 2-10)
  • Via menu Filled Via, Stacked Via, etc.
  • Narrow pitch CSP with 0.3mm pitch
  • Thinner thickness 0.3mm(6 layer), 0.58mm(10 layer)

H-MV Series HDI PCBs

Ultra high reliable PCB is enabled by the severe manufacturing management.

  • PTH PCB 4 layers to 20 layers
  • Sequential lamination 4 layers to 20 layers
  • Buildup PCB up to 2-x-2 (x: 2-10)
Any layer IVH PCB 12 layer (5-2-5)
全層IVH基板12層(5-2-5)
Sequential lamination 8 layer (2+4+2)
貼り合せ基板8層(2+4+2)
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