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Advanced Technologies

F-ALCS Technology

About F-ALCS Technology

We have developed the innovative technology, F-ALCS which maximizes wiring capacity of printed wiring boards. These boards with high wiring flexibility have knocked the bottom out of product development.

F-ALCS ensures highly reliable connections between vias thru paste filling and metal bonding which allow more than two times higher wiring density than before. It is optimal for difficult designs which were previously considered to be impossible.

Feature The 5 common challenges
in PCB manufacturing are
now solved by F-ALCS

01
Reduce restrictions in design and enable high performance!

All you have to do is to place vias on a layer only where you need them. This innovation and using smaller via pads make it possible to place parts with less restrictions because they leave a lot more space for mounting and wiring on a printed wiring board. F-ALCS is applicable to large-sized printed wiring boards such as the any layer IVH structure with the maximum seventy-two layers. This means it can hold the same amount of wiring as one hundred forty layers.

Differences in wiring and mounting areas between regular
IVH structure and F-ALCS structure

02
Reduce the number of open circuited stubs and perform high-speed signal transmission!

The transmission loss of high-speed signal caused by open stubs is solved by the any layer IVH structure. This reduces return loss and helps printed wiring boards to have good transmission characteristics even for high frequency, which results in high-speed signal transmission.

Transmission Characteristics Comparison between
F-ALCS and Conventional PCB structure

03
Reduce process steps by 50% and shorten delivery time!

By using the any layer IVH with one-time lamination, F-ALCS allows you to decrease the manufacturing process steps by 50%. F-ALCS also reduces restrictions in printed wiring board design which eventually reduces the number of designing process steps. This means it shortens manufacturing lead time drastically and it leads to short delivery times.

Different numbers of process steps
for regular IVH PCB and F-ALCS PCB

04
Applied to any material and meet a wide range of requirements

F-ALCS allows you to choose from many resins from regular FR-4 to low loss materials. Since it can be used in various ways for various uses, F-ALCS enables printed wiring board manufacturing to meet your needs and expectations.

05
No need to plate and easy on the environment

Because the plating process is not necessary for connecting vias which sometimes requires using toxic substances, printed wiring board manufacturing is easy on the environment. This also enables to shorten manufacturing time.

Voice Customer feedback

Here are some testimonials from our customers who used the F-ALCS technology.

  • Managed one of the newest semiconductors with high density wiring

    As the integration of semiconductors increased, the amount of required wiring in a printed wiring board for wafer test has also increased. We were having trouble with the former printed wiring board design because the wiring density had reached its limit.

    By using the F-ALCS, we were able to have higher wiring density on the printed wiring board which made it possible to have our semiconductor test done.

  • Shortened delivery time by shortening development time

    We often had to adjust our work schedule with our client due to the fact that we couldn’t make the deadline they required, because we had to wait for the former high layered, high density printed wiring boards to be supplied.

    Printed wiring boards with the F-ALCS technology has made it possible for us to meet the deadline our client sets because it doesn’t require as much design and production time as the former printed wiring boards.

  • Enable high frequency transmission without open circuited stubs

    The speed of signal transmissions on our printed wiring board needed to be increased because the speed of network systems has been accelerated. However, the solution to this issue was difficult to resolve because reducing the open circuited stubs in vias was quite challenging.

    With the F-ALCS technology that adopts the all layer build up structure, designing a printed wiring board has become easier because we don’t have to worry about creating open circuited stubs.

Case Study Product outline

01
For high density wiring (F-ALCS)

Specification
PWB size φ480mm
Construction 76 layers
Pad pitch 495µm
Pad diameter φ300µm
Via diameter φ180µm
Dielectric thickness 100µm
Thickness 7.4mmt
Structure

<X-section>

高密度配線向け (F-ALCS)

02
For high density mounting (F-ALCS + build-up structure)

Specification

<F-ALCS Core>

PWB size □150mm
Construction 28 layers
Pad pitch 280µm
Pad diameter φ170µm
Via diameter φ110µm
Dielectric thickness 60µm
Structure

<X-section>

For high density mounting (F-ALCS + build-up structure)
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