01

High degree of PCB Design freedom

The core advantage of F-ALCS technology lies in its design flexibility. Our F-ALCS enables the placement of vias (holes for electrical connection between layers) only on the required layer. The technology also allows the reduction of via in pads diameter which increases the possibilities for parts placement. By removing these two constraints, the available area for wiring can be greatly expanded.
Currently the technology enables up to 72 layers any layers IVH structure with the wiring level of 140 layers.

Surface Mounting area expansion

To create a transmission line in regular IVH PCBs, through holes need to be drilled from the top and bottom side of the PCB. This creates inevitable holes on the board surface which result in the reduction of available mounting surface.
By placing vias only on the needed layers to then laminate all the layers together in a one-time lamination with our conductive paste, F-ALCS lifts the mounting area design limitations encountered with the regular structure.

Wiring Capacity improvement

As shown in the comparison figure below, by pasting the layers together, F-ALCS enables the placement of as many vias a necessary in the desired part, avoiding the though hole that cause wiring restrictions (open stubs). This makes it possible to increase the wiring route and density by removing unnecessary vias in the internal structure of the PCB.

02

Transmission loss and reflection loss reduction for a High-speed signal transmission

As the realm of high-speed communication pushes the boundaries, signal transmissions now soar beyond 100 GHz. However, the conventional through-hole stub introduces a disruptive interference within this wavelength. In contrast, by using our conductive paste, our any-layer IVH (Interstitial Via Hole) technology approach stands as a stubless solution, facilitating uninterrupted high-speed transmission. Our all-layer IVH technology prevents the generation of stubs at the via level that interfere with high-speed signal transmission. By reducing the return loss, transmission characteristics up to high frequencies can be obtained and faster signal transmission can be expected. The figure below compares the transmission characteristics between F-ALCS and Conventional PCB structures.
By realizing an All layer IVH structure, our F-ALCS technology eliminates unnecessary via stubs. By reducing open stubs that reduces the transmission and reflection losses, this technology makes it possible to achieve an excellent transmission characteristic making it appealing for PCB for high-performance AI servers and 5G communications devices that require high-frequency capacity.

Transmission Characteristics Comparison between
F-ALCS and Conventional PCB structure

03

One-time lamination for a 50% process step reduction

Traditionally, we count 10 manufacturing process steps to manufacture regular IVH PCBs, from the formation of the wiring of the inner layer to the formation of the surface layers, including the plating process and sequential lamination. However, with F-ALCS the process consists in using the conductive paste to wire the inner layer in parallel after forming IVH by laser drilling. All via connections are then completed by performing a one-time lamination. This new manufacturing cuts out manufacturing steps to 5 steps, leading to a shorter delivery time.

Manufacturing process steps comparison
between Regular IVH PCB and F-ALCS PCB

04

Environmentally friendly process without the Plating process; 40% CO₂ emission reduction!

The distinctiveness of this technology lies in its alignment with the escalating environmental concerns of our times. Given the contemporary emphasis on sustainability, we search for alternative process solutions to reduce wastewater treatment and electricity consumption as much as possible.
Our original technology ALCS is unique in terms of ecological friendliness since it doesn't require a plating stage. By opting for the conductive paste printing process for the via connection, waste liquid treatment such as plating solution is avoided.
Choosing this technology has proved the reduction of running costs (water, electricity, and processing time) and CO2 emissions during the manufacturing process by approximately 40%. We are committed to providing environmentally friendly products through environmentally friendly F-ALCS manufacturing processes.