Product
FC-BGA Substrates
GigaModule-2
FC-BGA Substrates GigaModule-2
A state-of-the-art large FC-BGA packaging substrate with >100mm□ size buildup is available for large Die and multi-chip packaging with small quantity and short-term manufacturing
Inside FICT's Fully Automated LSI Package Fab
Discover FICT's fully automated LSI package substrate manufacturing facility, where advanced technology meets monozukuri. In this video, we introduce our state-of-the-art fab, designed to deliver the precision, reliability, and quality required to support the world's most advanced semiconductors.
We developed the base of the Semiconductor Packaging Substrate
Meet our members bringing insightful information and little-known anecdotes about the Semiconductor Packaging Substrate World
Features
- 30,000 pin count and >100mm□ size of 16-n-16 buildup substrate is available. ( n: Core layer)
- Our state-of-the-art high-density large FC-BGA package is suitable for high frequency and high-power applications with thick copper core-layer.
- Our total substrate solution from the package design enables small quantity and short-term manufacturing.
Example of multi-pin LSI mounting
Design Rule
Cross-section
High Density IVH
Thick Copper Pattern
Mechanical Characteristics
Realize improvement of mechanical characteristics by applying a variety of materials.
Electrical Characteristics
Propose optimum design for high frequency and high-power application with electrical and physical simulation.
Measured value of transmission characteristics
for low Df material
Product Application
- Server/MPU for HPC
- ASIC/Logic/Graphics
- FPGA
Advanced Technologies
Back to top
Product
Back to top
Solution Services
Back to top
Technical Services
Back to top
