Product
FC-BGA Substrates
GigaModule-2
FC-BGA Substrates GigaModule-2
A state-of-the-art large FC-BGA packaging substrate with >100mm□ size buildup is available for large Die and multi-chip packaging with small quantity and short-term manufacturing
We developed the base of the Semiconductor Packaging Substrate
Meet our members bringing insightful information and little-known anecdotes about the Semiconductor Packaging Substrate World
Features
- 30,000 pin count and >100mm□ size of 16-n-16 buildup substrate is available. ( n: Core layer)
- Our state-of-the-art high-density large FC-BGA package is suitable for high frequency and high-power applications with thick copper core-layer.
- Our total substrate solution from the package design enables small quantity and short-term manufacturing.
Example of multi-pin LSI mounting
Design Rule
Cross-section
High Density IVH
Thick Copper Pattern
Mechanical Characteristics
Realize improvement of mechanical characteristics by applying a variety of materials.
Electrical Characteristics
Propose optimum design for high frequency and high-power application with electrical and physical simulation.
Measured value of transmission characteristics
for low Df material
Product Application
- Server/MPU for HPC
- ASIC/Logic/Graphics
- FPGA
Advanced Technologies
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