F-ALCS technology is a proprietary any-layer interconnect technology designed for high-density, high-speed PCB applications. F-ALCS enables all layers to be interconnected through a one-time lamination process, forming an Any-Layer IVH (Interstitial Via Hole) structure using a revolutionary conductive paste. This approach eliminates conventional stacking limitations and enhances design flexibility. Currently, the technology supports up to 72 layers in an any-layer IVH structure, achieving a total wiring capability equivalent to 140 layers. F-ALCS is well suited for demanding applications such as probe cards--including main boards and space transformers--as well as advanced high-multilayer PCB designs."

As high-end DRAM testing continues to demand increasing layer counts, conventional PCB technologies face critical limitations due to aspect ratio constraints and material handling difficulties.

To address these challenges, FICT has developed ALCS-BBC technology. Unlike traditional methods, ALCS-BBC directly connects Boards together. This innovative structure makes it possible to achieve extremely high aspect ratio connections--such as AR66--and enables ultra-thick, high-layer-count designs, including structures with up to 160 layers and 10 mm thickness, surpassing the boundaries of conventional multilayer PCB technologies.

As device demands shift toward high-precision optical integration and fine-pitch interconnects, conventional organic substrates fall short due to thermal expansion and warpage, driving to dimensionally stable glass-based solutions. While glass offers superior material properties, single-glass structures face challenges such as easy cracking and TGV reliability issues. To overcome this, FICT adopts a multilayer approach, combining glass with resin layers that absorb and disperse stress, significantly improving mechanical robustness and crack resistance. Building on this concept, G-ALCS introduces a low aspect ratio TGV stacked architecture that reduces stress between glass and copper plating, minimizes copper volume, and enhances reliability under thermal cycling. G-ALCS represents a promising technology currently being advanced through research and development at FICT's R&D centers.