2026/10/05
Information
FICT to Present on 3D Glass Chiplet Packaging at IMPACT-IAAC 2026
FICT is pleased to announce that President & CEO Takahisa Amemiya will present the latest advancements in FICT's multilayer glass substrate technology at IMPACT-IAAC 2026, a leading international conference for advanced packaging and PCB technologies.
Presentation Details
| Seminar Title | |
| Date |
October 19 [Mon.] , 2026 16:40-17:10
|
| Speaker | Takahisa Amemiya (President & CEO, FICT LIMITED) |
| Venue |
Grand Hilai Taipei 3F, Platinum Grand Ballroom B
|
| Session | 【S1】 IAAC (IMAPS All Asia Conference) - Substrate Ecosystem and Growth: Scaling ABF, Glass, and High-Density IC Substrates for an AI‑Driven World |
| Presentation Language | English |
Conference Overview
| Event Name | IMPACT-IAAC 2026 |
| Dates | Oct. 19 [Mon.] -22 [Thur.], 2026 |
| Time | 10:00-17:00 |
| Theme | Energy-Efficient AI: From Computing to Systems and Applications |
| Venue | Grand Hilai Taipei (Oct.19) Taipei Nangang Exhibition Center II (TaiNEX 2, Oct.20-22) |
| Organizer | IEEE-EPS, iMAPS Taiwan, ITRI, TPCA |
| Co-located Exhibitions | TPCA Show, TAITRONICS, AIoT Taiwan |
Join us at IMPACT-IAAC 2026 to learn how FICT's glass substrate technology is helping shape the future of 3D glass chiplet packaging.
Visitors interested in learning more are also invited to visit the AMPOC Far-East Co., Ltd. booth (K-909) at TPCA Show 2026, where the glass substrate samples featured in this presentation will be showcased.
For more information, please see our TPCA Show 2026 Exhibition Guide.