We are pleased to announce that we will be participating as a Silver Sponsor at "SWTest Asia 2026" an international conference on semiconductor testing held in Taiwan from November 5 to 6.

At this year's exhibition, FICT will showcase its latest advancements in high-layer-count PCBs,advanced glass-core substrate technologies, and probe card solutions for next-generation semiconductor packaging and testing.

Featured Technologies and Products

• ALCS-BBC High-Layer-Count PCB Technology (180 Layers, 11.5 mm Thickness)
• Glass All Layer Z-connection Structure (G-ALCS) Technology
• Probe Card PCBs (ST Board / Main Board)
   ・Supports full-contact micro-bump testing for HBM 3E
   ・Compatible with MEMS probe card applications
• Semiconductor Package Substrates

We look forward to seeing you at SWTest Asia 2026 ！