FICT - The Future is interconnected

News
2026/06/01
Event

FICT CEO to Speak at JIEP Advanced Electronics Packaging Technology Symposium

We are pleased to announce that our President & CEO, Takahisa Amemiya, will be speaking at the JIEP Advanced Packaging Technology Symposium, held as part of the Total Solution Exhibition for Electronic Equipment 2026.

Presentation Details
Seminar Title
Glass Multilayer Technology for Advanced Next-Generation Semiconductor Packaging
Date June 12 (Fri.), 2026, 14:20-15:10
Speaker Amemiya Takahisa (President & CEO, FICT Ltd.)
Venue Symposium B
Registration https://jpca2026.tems-system.com/eguide/en/sem/jiep/seminar_details/pqHjacJXb9U
Presentation Language Japanese
Event Overview
Event Name JIEP Advanced Packaging Technology Symposium
Dates June 10 (Wed) - June 12 (Fri), 2026
Time 10:00-17:00
Venue Tokyo Big Sight (Symposium Rooms A & B)
News
Sort

Annual archive

Category