2026/03/16
Event
Our participation to ICEP-HBS 2026
We would like to extend an invitation to visit us at the International Conference on Electronics Packaging joined with Hybrid Bonding Symposium (ICEP-HBS 2026) from April 14 to 17, 2026 at the International Conference Center in Hiroshima, JAPAN.
Exhibition Information
| Name of the symposium: | |
| Date: |
April 14 [Tue] - 17 [Fri], 2026 |
| Venue: |
International Conference Center Hiroshima |
| Registration: |
To register online, please visit ICEP-HBS 2026 website. |
We hope to see you at ICEP-HBS 2026 !
