2026/01/27
Event
Our First Exhibition at OFC 2026
We are pleased to announce that we will be exhibiting for the first time at the Optical Fiber Communication Conference and Exhibition (OFC 2026), held in Los Angeles, USA, from March 17 to 19, 2026.
OFC is one of the world's largest international conferences and exhibitions in the field of optical communications and is a premier event where the latest trends in optical network technology come together.
OFC is one of the world's largest international conferences and exhibitions in the field of optical communications and is a premier event where the latest trends in optical network technology come together.
Event Overview
| Exhibition Name | OFC 2026 (The Optical Fiber Communication Conference and Exhibition) |
| Exhibition Date | March 17 (Tue) - 19 (Thu), 2026 10:00 AM - 5:00 PM
(Technical Conference starting March 15)
|
| Venue | Los Angeles Convention Center, California, USA |
| Booth No. |
Japan Pavilion (Booth No. 1859) / South Hall |
| Registration |
Conference & Exhibit Registration For free entry to the exhibition hall, please register using the Exhibits Pass Plus (EPP) via the OFC official website. |
Contents of the Exhibition
Special Exhibit
| 160 Layers, 10mmt Main PCB prototype redefining high-density interconnect |  |
1.Glass All Layer Z-connection Structure (G-ALCS) Technology
|
We will be exhibiting a prototype of our multilayer glass substrate, developed by electrically connecting all layers using our proprietary F‑ALCS technology. |
2.F-All Layer Z-connection Structure (F-ALCS) Technology
| Using a specialized conductive paste for via formation, this environmentally friendly, plating‑free process enables the fabrication of IVH multilayer boards with more than 70 layers in a single lamination cycle. |
3. Probe Card, Space Transformer PCBs
| Probe card and space transformer PCBs for semiconductorr testing devices. |
4.High end substrate package for Large FC-BGA PCB
| State-of-the-art large FC-BGA packaging substrate (□100mm) optimal for large Die and multi-chip packaging mounting. |
