Opening of a New R&D Center as a Hub for Next-Generation Interconnect Technology Development

We have established a new Research & Development Center to accelerate technology development for ultra-high multilayer PCBs, semiconductor-related substrates, and semiconductor device-related substrates, with the goal of achieving early advancement of 3D multilayer interconnect technologies.
We will continue driving innovation and the creation of cutting‑edge technologies.

• Purpose of Establishment

1. Accelerating Growth in Semiconductor-Related Businesses
   By developing proprietary technologies and accumulating expertise in high value‑added fields such as ultra‑high multilayer PCBs, probe cards, and FC‑BGA packages, we aim to strengthen our business competitiveness and achieve sustainable growth.
2. Establishing Next-Generation Technologies
   We will promote research and development in innovative areas, including 3D multilayer interconnect technologies.

• Research and Development Center：

Nagano Laboratory
36, Oaza Kitaowaribe, Nagano-shi, Nagano 381-8501, Japan

Kawasaki Laboratory
MUZA Kawasaki Central Tower, 12th floor 1310 Omiya-cho, Saiwai-ku, Kawasaki-shi, Kanagawa 212-8554, Japan

Itoshima Laboratory
1963-4 Higashi, Itoshima, Fukuoka 819-1122, Japan