FICT to Present Breakthrough PCB Technology at SWTest Asia 2025
FICT is pleased to announce its participation in SWTest Asia 2025, held in Fukuoka, Japan, a premier technical conference focused on microelectronic wafer and die level testing .
Following a successful presence last year, we will again be exhibiting at Booth 302 and delivering a technical presentation introducing a groundbreaking advancement in Main PCB technology.
■Technical Presentation
| Title | Breaking Boundaries: Over 160 Layers, 10mmt Main PCB Redefining High-Density Interconnect |
| Speaker |
Sohei YASUDA (PWB Product Development Department Manager at FICT Limited ) |
| Date & Time | Friday, November 21 17:00 - 17:30 |
| Program Details | https://www.swtestasia.org/program/ |
In this presentation, we'll introduce an innovative technology that breaks industry norms, achieving a 160-layer, 10mm-thick ultra-multilayer PCB.
■Exhibition
We invite all attendees to visit Booth 302, where the 160 Layers, 10mmt Main PCB prototype will be on display.
We look forward to connecting with you at SWTest Asia 2025！
