FICT - The Future is interconnected

News
2025/11/12
Event

Our Participation at SEMICON Japan 2025

We are pleased to announce that we will be exhibiting again this year at SEMICON Japan 2025, held at Tokyo Big Sight from December 17 (Wed) to 19 (Fri), 2025.
This year, we are proud to present the world's first 160-layer, 10mmt Main PCB prototype, made possible by our breakthrough PCB technology ALCS-BBC.
We look forward to seeing you at our booth!

Exhibition Information

Exhibition Name

SEMICON Japan 2025

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Date December 17 (Wed) - 19 (Fri), 2025 | 10:00 - 17:00
Venue Tokyo Big Sight, East Hall 6 (3-10-1 Ariake, Koto-ku, Tokyo 135-0063)
Booth No. 6207
Registration Online Registration is required to visit the exhibition.
Please register in advance from the SEMICON Japan site

Contents of the Exhibition

Special Exhibit: World first 160 Layers, 10mmt Main PCB prototype

  • Glass All Layer Z-Connection Structure (G-ALCS)
  • F-All Layer Z-Connection Structure(F-ALCS Technology)
  • High-End Substrate Package for Large FC-BGA PCB
  • Probe Card & Space Transformer PCBs
  • Ultra-High-Speed Transmission / Ultra-High Multilayer PCBs