FICT Executive Advisor Akira Tamura to Join Expert Panel at 2025 IEEE ECTC
We are proud to announce that our Corporate Executive Advisor, Mr. Akira Tamura, has been invited as a panelist at the upcoming IEEE 75th Electronic Components and Technology Conference (ECTC).
Mr. Tamura will participate in Special Session 4: "Glass Core vs. RDL Interposers: Ready for Prime-Time?", held on Tuesday, May 27, from 10:30 AM to 12:00 PM in Texas, USA.
This session will bring together leading voices in the semiconductor packaging industry to explore the economic and technical perspectives on high-volume solutions for next-generation substrates.
With a focus on design, materials, processing, equipment, and metrology, the discussion will examine how glass-core and RDL interposer technologies are shaping the future of advanced packaging.
We are honored to see Mr. Tamura contributing his deep expertise to this critical industry dialogue.
We hope to see you at ECTC in Texas !
Exhibition Information
| Conference Name |
2025 IEEE 75th Electronic Components and Technology Conference (ECTC) |
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| Date | May 27 - 30, 2025 | ||||
| Venue |
Gaylord Texan Resort & Convention Center Address: 1501 GAYLORD TRAIL, GRAPEVINE, TEXAS, USA, 76051 |
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| Registration |
To register online, please visit ECTC 2025 |
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| Special Session Panel Discussion |
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