2025/04/09
Event
Our participation to ICEP-IAAC 2025
We would like to extend an invitation to visit us at the International Conference on Electronics Packaging joined with iMAPS All Asia Conference (ICEP-IAAC 2025) from April 15 to 18, 2025 at the Wakasato Municipal Cultural Hall in Nagano, JAPAN.
We are glad to inform you that our Corporate Executive Advisor Mr. Akira Tamura, will introduce our Multilayer Glass Core Substrate Technology in a technical presentation.
We hope to see you at ICEP-IAAC2025 in Nagano !
Exhibition Information
| Name of the symposium: |
International Conference on Electronics Packaging joined with iMAPS All Asia Conference (ICEP-IAAC 2025) |
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| Date: |
April 15 [Tue] - 18 [Sat], 2025 |
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| Venue: |
Wakasato Municipal Cultural Hall |
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| Registration: |
To register online, please visit ICEP-IAAC2025 website. |
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| Presentation |
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