2024/11/05
Event
Our participation to APCS/SEMICON Japan 2024
We will be exhibiting at the Advanced Packaging and Chiplet Summit (APCS), which is co-located with SEMICON Japan 2024, at Tokyo Big Sight from December 11 to 13, 2024.
Under the main theme of "The Future is Interconnected", we will showcase our advanced solutions applied to our PCBs for semiconductor equipment.
We hope to see you at our booth !
Exhibition Information
| Name of exhibition: |
Advanced Packaging and Chiplet Summit (APCS)  |
| Date: |
December 11 [Wed] - 13 [Fri], 2024 |
| Place: | Tokyo Big Sight East Hall 3 Address:3-10-1, Ariake, Koto-ku, Tokyo 135-0063 |
| Booth No.: |
No.3448 |
| Registration: |
Online Registration is required to visit the exhibition. |
|
Concurrent Events |
SEMICON Japan 2024 ADIS（Advanced Design Innovation Summit）2024 FLEX Japan 2024 |
Booth
Contents of the exhibition
Main theme: The Future is Interconnected
1.Glass All Layer Z-connection Structure (G-ALCS)
| We will exhibit the Multilayer glass substrate prototype we created by bonding each glass PCBs with a resin and connecting all the layers with our F-ALCS technology. |  |
2.High end substrate package for Large FC-BGA PCB
| We will exhibit a state-of-the-art large FC-BGA packaging substrate (□100mm) optimal for large Die and multi-chip packaging mounting. |  |
3. "F-ALCS" technology (F-All Layer Z-Connection structure)
| We will exhibit our F-ALCS technology. With the use of a conductive paste for Any Layer IVH structure we can avoid the plating process and create 70+ layers PCBs by going though the laminating process just once. |  |
4. Probe Card, Space Transformer PCBs
| We will exhibit our latest probe card and space transformer PCBS for semiconductorr testing devices. |  |
5. Ultra-high-speed transmission/ultra-high multilayer PCBs
| We will exhibit our PCB with ultra-high-speed transmission for supercomputers, 5G infrastructure, and HPC substrates. |  |
