Our participation to the International Conference on Electronics Packaging (ICEP2024)
We would like to extend an invitation to visit us at the International Conference on Electronics Packaging (ICEP2024), held on April 17 to 20, 2024 at the Toyama International Conference Center in Toyama, JAPAN.
We are glad to inform you that our Advanced Technologies Development Dept. SM Taiji Sakai, Vice General Chair and Operation Committee Chair of this event, will introduce our Multilayer Glass Core Substrate Technology in a technical presentation.
We hope to see you at ICEP2024 in Toyama !
Exhibition Information
| Name of the symposium: |
2024 International Conference on Electronics Packaging (ICEP2024) |
| Date: |
April 17 [Wed] - 20 [Sat], 2024 |
| Venue: | Toyama International Conference Center Address: 1-2 Ote-machi Toyama-city Toyama，Japan |
| Registration: |
To register online, please visit ICEP2024 website. |
Technical Presentation
| Title | "Multilayer Glass Core Substrate Technology with Using Conductive Paste" |
| Content | Latest update on the development status of our multilayer glass core substrates pushing the limits of density and reliability. |
| Date | Update soon |
Featured Technology
・Hybrid glass any layer G-ALCS technology
We will exhibit the Multilayer glass substrate prototype we created by bonding each glass PCBs with a resin and connecting all the layers with our F-ALCS technology.
・Glass core package substrate (sample display)
We are planning to exhibit a glass core package substrate made possible with our G-ALCS technology.
