International Symposium on Microelectronics and Packaging (ISMP 2023) Exhibition Guide
We would like to extend an invitation to visit our booth at the 21st International Symposium on Microelectronics and Packaging (ISMP), held from 25 - 27 October 2023 at the Paradise Hotel Busan, Korea.
We will be showing our multi-layered glass substrate "G-ALCS" technology . This technology was made possible by applying to glass substrates our F-ALCS structure technolgy which consist in bonding the layers together with a conductive paste.
We hope to see you there !
Exhibition Information
| Name of Symposium: |
21st International Symposium on Microelectronics and Packaging (ISMP 2023) |
| Date: |
October 25(Wed.) ~ 27(Fri.), 2023 |
| Place: |
Paradise Hotel, Busan, Korea |
| Access | Please visit ISMP website for more information about the access. |
| Registration: |
Please visit ISMP 2023 website to register. |
About ISMP
ISMP is the top-tier international event that brings together the expertise in electronics packaging and microelectronic systems from academia to industry.
