JPCA Show 2023 Exhibition Guide
We would like to extend an invitation to visit our booth at the JPCA Show 2023, which will be held from May 31st to June 2nd, 2023 at Tokyo Big Sight.
We will showcase our innovative technologies with our slogan "The Future is Interconnected" as our main theme.
We have enclosed a map and a program giving details about the exhibition.
We hope to see you at our booth !
Exhibition Information
| Name of exhibition: |
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| Date: |
Mai 31 [Wed] - June 2 [Fri], 2023 |
| Place: | Tokyo Big Sight Hall 6 Address:3-10-1, Ariake, Koto-ku, Tokyo 135-0063 |
| Booth No.: | No. 6E-6 |
| Registration: |
Online Registration is required to visit the exhibition. |
Booth Map
Contents of the exhibition
Main theme: ～The Future is Interconnected～
1.Solutions for Semiconductor
・Large size FC-BGA substrate
We will exhibit our state-of-the-art large FC-BGA packaging substrate (>100mm□) optimal for large Die and multi-chip packaging mounting.
・PCB for leading-edge LSI test boards
We are planning to exhibit our Multi Layer Organic with 12 build-up structure on one side.
2.Solutions for Multilayer PCBs
・F-ALCS Technology
We will exhibit our F-ALCS technology. With the use of a conductive paste for Any Layer IVH structure we can avoid the plating process and create 70+ layers PCBs by going though the laminating process just once.
3.Advanced Technologies
・Hybrid glass any layer G-ALCS technology
We will exhibit the Multilayer glass substrate prototype we created by bonding each glass PCBs with a resin and connecting all the layers with our F-ALCS technology.
・Next-generation high performance HPC
We will show the ultra-high speed transmission PCB solution we provide for Supercomputers, 5G Infrastructure, HPC substrate, etc.
