JPCA Show 2021 Exhibition Guide
We are pleased to inform you that we will participate at the JPCA Show 2021 Exhibition held at the Big Sight convention center in Tokyo from October 27 through October 29, 2021.
We will be exhibiting advanced PCB technologies for a large sized FC-BGA buildup substrate, organic wafer probe cards for latest 5G devices using F-ALCS technology and high density and low-loss PWB for high-performance computing, EHF devices, and etc.
Finally, we plan to show CPU Memory Unit of supercomputer Fugaku.
We hope you will stop by our booth and take a look at our exhibit.
Exhibition Information
| Exhibition | JPCA Show 2021 |
|---|---|
| Dates | October 27 [Wed] - 29 [Fri], 2021 10:00 - 17:00 |
| Place | Tokyo Big Sight South Hall 3 |
| Booth Nbr. | No. 3C-02 |
| Note | Online Registration is required to visit the exhibition. Please register in advance from the JPCA Show 2021 official site below. https://f-vr.jp/jpca/en/jpca_jizen/ |
Booth map
Contents of the exhibition
Innovative PCB Solutions
co-creating unique value with customers
1. Solutions for Semiconductor and LSI testing
Introduction of the F-ALCS technology enabling huge wiring capacity for latest logic device testing, and high-density organic wafer level probe cards for latest devices. We plan to show large size FC-BGA substrate.
2. Solutions for high-performance computing
Introduction of high-density and low-loss PCBs for high-performance computing,5G millimeter wave(25Ghz) antenna PCB, and other PCB for EHF devices.
We also plan to show CPU Memory Unit of supercomputer Fugaku.
3. Solutions for a wide range of Automotive applications
We plan to show bus-bar laminated thick copper PWB for PCU, high reliable buildup PCBs for around view monitor devices, We provide total solutions including PCB design, manufacturing and assembly for Automotive, tablet PCs and IoT modules.
