FICT - The Future is interconnected FICT - The Future is interconnected

News
2021/01/14
Event

Our online Presence at Nepcon Japan 2021

Thank you for visiting our online booth. See you at Nepcon Japan 2022 next year !

Our virtual technical seminar is still open at our official YouTube Channel.

We are pleased to inform you that we will participate at Nepcon Japan 2021(PWB EXPO 2021 Exhibition) with online base. We will be co-exhibiting with FUJITSU KYUSHU NETWORK TECHNOLOGIES Ltd. under the theme:
"Comprehensive Strength of the FUJITSU Group for your Next-Generation Product Development."
Our technologies and solution services will provide our customers with added value in each phase of the product development process.
This year you will be able to see the CPU Memory Board we produce for Supercomputer Fugaku at our online virtual booth.
We hope to see you at our online virtual booth !

Exhibition Information

Exhibition Nepcon Japan 2021 ONLINE
 Note: This year we will participate online PWB EXPO at our virtual booth.

To reach our online booths, please follow the steps below.

  • Step-1 Click on the link of URL in the invitation mail sent from Nepcon 2021 after your registration
  • Step-2 Click on "Enter Exhibition Hall"
  • Step-3 Click on the magnifying glass icon and enter "FUJITSU", then you can find FUJITSU INTERCONNECT TECHNOLOGIES and our co-exhibitor FUJITSU KYUUSYU NETWORK TECHNOLOGIES
Dates January 20[Wed]-22[Fri]
 Note; Message exchange with chat will be available from 10am to 5pm(JST).
Services at online booth
  • Virtual technical seminar will be open.
  • Latest product catalogue downloading is ready.
  • Our latest PCB appication will be introduced.

Our Products

We will introduce the latest advanced technologies we have developed to provide the best solution to our customers.
PCB application for supercomputer Fugaku , 5G millimeterwave antenna devices, organic wafer probe cards with F-ALCS technology and in-vehicle millimeterwave radar are introduced.

Solutions for
Next-generation high performance HPC

Fugaku_tcm203-4714840_tcm203-2750236-32.png

Solutions for
Next-generation high performance HPC
We will show the ultra-high speed transmission PCB solution we provide for Supercomputers, 5G Infrastructure, HPC substrate, etc.
#5G #Fugaku Supercomputer #HPC #Cloud 

Solution for
Cutting edge LSI test technology

probe_01_tcm202-4535008_tcm202-2750236-32.jpg

We will show the innovative technologies we provide for high-capacity, high-speed transmission and low power consumption.
Discover our unique F-ALCS technology.
#Tester #Probe Card #Processor #AP 

Solutions for
CASE technologies

build-up_01_tcm202-4535007_tcm202-2750236-32.jpg

We provide printed circuit board solutions from design to component mounting for various automotive and mobile products to contribute to the Mobility Society.
#PCU #ECU #ADAS #In-Vehicle Infotainment