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Advanced Technologies

F-ALCS Technology

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Multilayer PCB (High Density Interconnect PCBs/High Speed Transmission PCBs/Thick Copper PCBs)
HDI PCBs
Probe Cards
Substrate structure with embedded TFC (Thin Film Capacitor), GigaModule-EC
FC-BGA Substrates GigaModule-2

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Reliability Evaluation, Failure Analysis

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