FICT - The Future is interconnected

Advanced Technologies

We respond to the needs of the most advanced
technologies in order to create new value that
opens up the future together with our customers.

F-ALCS Technology

F-ALCS Technology Read More

Our F-ALCS advanced structure technology enables both high speed signal transmission and high density wiring capacity for a better product competitiveness.

G-ALCS Technology

G-ALCS Technology Read More

Through our F-ALCS technology initiative, we are working toward the integration of a glass substrate into the semiconductor packaging with our G-ALCS (Glass All Layer Z-Connection Structure) technology, opening new avenues for advancement.

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