NEPCON JAPAN 2022 Exhibition Guide
We will exhibit at "NEPCON JAPAN 2022 (Printed Wiring Boards EXPO)", which takes place from January 19 to January 21 at Tokyo Big Sight.
Under the main theme of "Innovative PCB Solutions co-creating unique value with customers", we will showcase our large semiconductor packaging substrates and innovative Any Layer IVH structure, F-ALCS technology for the semiconductor multilayer substrate solution.
We plan to hold open seminars to introduce our innovative technologies and solutions in the presentation area of our booth.
We look forward to your visit to our booth.
Exhibition Information
| Name of exhibition: | |
| Date: |
January 19[Wed] - January 21[Fri], 2022 10:00 a.m. to 6:00 p.m. (until 5:00 p.m. on the last day) |
| Place: | Tokyo Big Sight East Hall 3 Address:3-10-1, Ariake, Koto-ku, Tokyo 135-0063 |
| Booth No.: | No.22-22 |
| Note: |
Invitation ticket is available at below. Visitor Ticket Request (Free) |
Booth Map
Contents of the exhibition
nnovative PCB Solutions co-creating unique value with customers
1.Innovative Any Layer IVH structure F-ALCS / G-ALCS technology
Along with the introduction of innovative any layer IVH structure F-ALCS technology, we will reference-exhibit a prototype PCB sample pioneered by utilizing a hybrid glass any layer G-ALCS technology.
2.Large Semiconductor Packaging Substrates
We will exhibit large semiconductor packaging substrates optimized for both large die and chiplet-evolved multichip packaging as well as high performance TFC embedded substrates.
3.High-Quality and High-Density Build-Up Substrates for Automotive Applications
We will exhibit high-density build-up substrates that are critical to support the increasing needs of automotive electrification such as automotive PCU, in-vehicle camera and audio applications.
Open Seminars
We plan to hold open seminars to introduce our innovative technologies and solutions in the presentation area of our booth.
- Introduction of FICT LIMITED
- Introduction of any layer IVH structure F-ALCS / G-ALCS technology
- Introduction of substrates for high-performance semiconductors and servers
