FICT - The Future is interconnected

Business

FICT's Business

We provide high-quality printed circuit boards and semiconductor package substrates used across a diverse array of fields,including supercomputers and high-end servers that support artificial intelligence and big data processing,as well as base stations and transmission equipment that establish high-speed,high-capacity 5G communication networks.By leveraging cutting-edge technology,we deliver solutions that meet a wide range of global demands.

Advanced Technologies

Discover the groundbreaking innovations of FICT with our advanced PCB technologies: F-ALCS and G-ALCS.

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High Layer Count PCBs

Multilayer PCBs

We provide highly reliable multilayer PCBs, high-speed transmission PCBs, and high-current/high-dissipation PCBs.

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HDI PCBs

We provide comprehensive solutions that include PCB design, mounting simulation, and manufacturing for high-performance, high-speed transmission equipment, including the latest communication devices.

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Board Design

We propose design rules to satisfy electrical performance, optimal materials and stack-up designs based on the requirements and the concept of our customers. We consider the final board design therefore we can offer a short development and design period, which results in a lower overall cost.

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Reliability Evaluation, Failure Analysis

In response to customer requests, we conduct a wide variety of reliability tests and conduct failure analysis suitable for elucidating failure mechanisms.

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Semiconductor related PCBs

Probe Cards

Our state-of-the-art technology delivers innovative organic printed circuit boards (PCBs) specifically designed for probe card applications. These PCBs feature an impressive wiring capacity of over 10,000 nets while ensuring high-quality signal integrity.

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Package Substrate

Semiconductor packaging substrates for high-performance large die multichip LSIs, that enable high energy efficiency at high-speed data transmission and high frequency stable operation with embedded thin film capacitors.

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The Essence of FICT

We developed the base of the Semiconductor Packaging Substrate

Meet our members bringing insightful information and little-known anecdotes about the Semiconductor Packaging Substrate World.

Chapters
2:19:
Probe Card, Multi Layer Organic
11:36:
Semiconductor Packaging Substrate
20:16:
Our Vision

High Precision Processing

Drilling, Routing

Drilling

Routing

Technical Services

Technical services such as data recovery, quality and reliabilitytesting, and fault analysis for storage device products such asHDDs, SSD and flash memory

Data Recovery Services

PC's lost data is recovered with state-of-the-art repair technology due to computer malfunctions and sudden hardware failure.

Data Erasure Service

We will reliably erase the data on the recorded media before leasing or disposing of information terminals, protecting customers from the risk of information leakage.

Failure Analysis & Reliability Testing Service

Visualize the cause and performance of hard disk and SSD failures to help improve storage quality.

Media Conversion Service

Transfer (convert) data recorded in old media to the latest media and connect your information assets to the next generation systems.